Home / Sponsors / Dish Wireless / Data Engineering
Does Dish Wireless sponsor H-1B for Data Engineering?
Yes — Dish Wireless files H-1B paperwork and hires data engineering.
Dish Wireless filed 421 Labor Condition Applications company-wide in FY2025–26
— about 13 for titles related to data engineering (median filed salary $103,248).
No open data engineering jobs are tracked right now.
0open data engineering jobs
13related LCA filings
$103,248median related salary
421company LCA filings
Free weekly email of new jobs at proven H-1B sponsors. Unsubscribe anytime.
No open data engineering jobs tracked right now. Get notified when Dish Wireless posts one.
Data Engineering salaries Dish Wireless filed
Related job titles from US DOL LCA filings (FY2025–FY2026), matched by title keywords — not a guarantee for any specific opening.
| Job title | Filings | Median salary |
|---|---|---|
| Data Engineer Ii | 8 | $95,680 |
| Senior Data Engineer | 5 | $115,357 |
More at Dish Wireless
Full Dish Wireless H-1B sponsorship page · All Data Engineering jobs at H-1B sponsors
Filing history shows an employer sponsors in general; it doesn't guarantee a specific role is sponsored. Title-family matching is heuristic. How we build this data · Request a correction