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Does Dish Wireless sponsor H-1B for Hardware & Embedded?

Yes — Dish Wireless files H-1B paperwork and hires hardware & embedded.
Dish Wireless filed 421 Labor Condition Applications company-wide in FY2025–26 — about 21 for titles related to hardware & embedded (median filed salary $108,321). No open hardware & embedded jobs are tracked right now.
0open hardware & embedded jobs
21related LCA filings
$108,321median related salary
421company LCA filings

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No open hardware & embedded jobs tracked right now. Get notified when Dish Wireless posts one.

Hardware & Embedded salaries Dish Wireless filed

Related job titles from US DOL LCA filings (FY2025–FY2026), matched by title keywords — not a guarantee for any specific opening.

Job titleFilingsMedian salary
Rf Engineer Ii11$103,938
Senior Rf Engineer10$113,142

More at Dish Wireless

Full Dish Wireless H-1B sponsorship page · All Hardware & Embedded jobs at H-1B sponsors

Filing history shows an employer sponsors in general; it doesn't guarantee a specific role is sponsored. Title-family matching is heuristic. How we build this data · Request a correction